Gigabyte CES 2009 Highlights

GIGABYTE Highlighted Ultra Durable 3 Technology and Impressed the Crowd with World Record Speeds on its INTEL and AMD Platforms at CES 2009

City of Industry, Calif., United States – GIGABYTE today is pleased to announce the success of its product showcase at this year’s CES 2009, January 8 to January 11, in Las Vegas, Nevada. While consumer electronics took CES 2009 by storm, GIGABYTE differentiated itself by showing and dazzling the crowd with its World Record setting speed on the motherboard model GA-MA79GX-DS4H, and the recently launch AMD Phenom II processor beyond 6 GHz (Overclocked). GIGABYTE also showcased its successor, the model GA-MA790GP-UD4H, which featured GIGABYTE Ultra Durable 3

Classic Technology, engineered to improve memory performance and overclocking capability by doubling copper layer in the PCB to 2 ounces, improving electrical conductivity, and improving overall system temperature, energy efficiency, and stability. The event successfully brought the GIGBAYTE crew and opinion leaders in the OC (OverClocking) community together to voice their praise of GIGABYTE’s innovation and engineering efforts to the enthusiast segments, further strengthening its current leading positioning in OC community.

The showcase was also aimed at unveiling GIGABYTE’s ability to build on the highend motherboard realm, including the complete lineup of latest INTEL Core i7 X58 platform with the innovation of GIGABYTE Ultra Durable 3 Technology, patented Dual BIOS, Hybrid Silent-Pipe 2, Hardware Over Voltage Control IC and Alert LEDs to indicate the status of voltage, temperature and overclocking. In addition to its flagship models GA-EX58 Extreme and GA-EX58-UD5, GIGABYTE also extends the current X58 platform to more affordable territory with the launch of the model GA-EX58-UD4P and GA-EX58-UD3R. The affordable targeted price point at around $200, will encourage the early adoption of X58 platform motherboards. GIGABYTE is currently the only motherboard maker offering Intel X58 platform at mainstream pricing point without the sacrifice of performance and feature sets.

To expand its footprint at CES2009, GIGABYTE partnered with AMD to showcase its model GA-MA790GP-DS4H at “Build your Own PC Race for Charity” event held at the Wynn Las Vegas Resort on January 8th. The annual Build Your Own PC Race for Charity has helped community and charities nationwide with over $2 million dollars donated. It has become a tradition for many media and customers to attend every year at CES. This year, the race was determined by assembling a PC based on new AMD Phenom II X4 Processor. The upcoming GIGABYTE Ultra Durable 3 Classic AMD Motherboard lineup with the support of Phenom II Processor is scheduled to launch by end of January, 2009 to leverage GIGABYTE’s current success of Ultra Durable 3 Technology in the market. For current AMD models, GIGABYTE delivers an easy BIOS update for users upgrade path to AMD's latest 45nm process technology enhancements including higher core clocks with greater energy efficiency over past generations, integrated DDR2/DDR3 memory controller (DDR3 memory support for AM3 processors and AM3 designed motherboards only), HyperTransport 3.0 and C1E enhanced power savings.

On the top of major debut at CES 2009, GIGABYTE also joined force with business partners to showcase its gaming solutions at CES 2009, including Kingston, Lian-Li, Topower and CyberPower.

“GIGABYTE has been well known for its leading technologies in the industry. In the motherboard world, GIGABYTE was the first to ship with DualBIOS protection and go beyond traditional 3 phase power design to offer 12 phase power and hardware-based dynamic 6 gear power saving design. GIGABYTE was also the first to implement all Japanese all solid capacitors, lower RDs(on) MOSFET, and Ferrit Core Chokes on its P35 and P45 Motherboard lineup to ensure the highest levels of reliability, stability, and performance under extreme conditions at lower system operating temperature. At CES 2009, GIGABYTE introduced another first “GIGABYTE Ultra Durable 3”.

By doubling the copper layers to 2 ounces for both power and ground layers, Ultra Durable 3 motherboards improve power efficiency by reducing circuit impedance by as much 50% and allowing more bandwidth for electron passage, delivering dramatically lower system temperatures and enhancing stability for overclocking. With GIGABYTE Ultra Durable 3 Technology, ordinary endusers are able to set world records by pushing memory DDR2 beyond 1800MHz without increasing much voltage.” said Gary Tam, Senior Technical Product Manager with GIGABYTE.

“GIGABYTE has a very positive outlook for the year 2009 based on its strong product positioning in terms of innovation, performance and quality with the focus on GIGABYTE Ultra Durable 3 Technology in the market and will continue to engineer products tailored to each market segment.“ says Tony Liao, Vice President at GIGABYTE North America.